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SOLIDWORKS World 2019

Electronics Thermal Management

Session Speakers
Session Description

Session Description: As the demand for increased performance in smaller packages rises, thermal management of electronics has become a top priority for designers and engineers. This session focuses on how to leverage SOLIDWORKS Flow Simulation in conjunction with SOLIDWORKS PCB to meet these demands.

Session Attendee Benefits

Session Attendee Benefits: Attendees will: - Understand the full capabilities of SOLIDWORKS Flow and the Electronics Cooling Module. - Develop confidence in the accuracy of these easy-to-use tools. - Learn how to more accurately model conduction in PCBs with thermal vias. - Setup best practices and importing board models.

Additional Information
Simulation
ECAD
Flow Analysis, Thermal Analysis
Gaining Proficiency (1 to 3 years of product experience)
Breakout Session
1h 30m
Session Schedule
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